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OAI Model 800E 型掩模對準系統

。各種光譜范圍選項:Hg燈:G(436nm)，H(405nm)， I(365nm)和310nm線，Hg-Xe燈:260nm和220nm

。基片尺寸范圍從4“8”直徑

。燈功率范圍從200到2000W或LED

。電腦操作和配方存儲

。易于使用的GUI和多功能操縱桿

。手動對齊在頂部和底部雙2 mp GigE攝像機和機動的X-Y-Z-Theta舞臺與操縱桿/菜譜操作

。升級到自動對齊w / Cognex軟件升級

。楔自動補償和機動z軸帶有編碼器和3點水準升級選項

。紅外光學背面對齊選擇升級

。接近(20um): 3.0um，軟觸點:2.0um，硬觸點:1um，真空觸點:≤0.5um

。提供正面和背面接觸和對齊0.5 - 1的準確性

。提供半自動化/研發和低容量生產模式

。適用于MEMS、半導體、Microfludic納米印記，PSS襯底和CLiPP流程

Model 800E Mask Aligner System

。 Various Spectra Range Options: Hg Lamp: G (436nm)， H (405nm)， I(365nm) and 310nm lines， Hg-Xe Lamp: 260nm and 220nm

。 Substrate sizes range from 4” to 8” diameter or square

。 Lamp Power range from 200 to 2，000W or LED

。 PC Operation and Recipe Storage

。 Easy to use GUI and Multifunction Joystick

。 Manual Alignment with Top and Bottom Dual 2MP GigE Cameras and Motorized X-Y-Z-Theta Stage with Joystick / Recipe Operation

。 Upgrade to Auto Alignment w/ Cognex Software Upgrade

。 Automated wedge compensation and motorized z-axis with encoder and option for 3 Point Leveling Upgrade

。 IR Optics Backside Alignment Option upgrade

。 Proximity (20um): <3.0um， Soft Contact: <2.0um， Hard contact: 1um and vacuum contact : ≤ 0.5um

。 Provides Front and backside exposure and alignment accuracy of 0.5-1um

。 Available in semi automated / R&D and low volume production modes

。 Applicable for MEMS， Semiconductor， Microfludic， NanoImprinting， PSS Substrate and CLiPP Processes