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3D-Sensor

Proprietary smart pixel sensor heliSense^TM S3with in-pixel signal processing of up to 1 million 2D-slices per second

(λ_center= 800 nm， Δλ = 40 nm， P_optical = 8 mW)

2 μm (standard configuration)

Z-axis

20 mm vertical scan range

100 nm resolution

Up to 50 mm per second

300 x 400 mm positioning range

1 μm resolution (100 nm optional)

Up to 100 mm per second

Graphical User Interface

Configuration and control of the system

Navigation via 2D-live-view

Graphical representation of 3D-topography and profiles

Data processing and analysis

Data management and storage

Automation of measurement tasks (recipes)

Interface

(scanner control， 3D-camera configuration and readout， 2D-camera configuration and readout， data processing algorithms

CSPs and micro-BGAs continue to increase the packaging density of PCBs， but the ever shrinking pad sizes make it harder to ensure the reliability of the solder joints. Advanced 3D-profiling provides reliable data on solder height and solder volume to fine-tune the screen printer configuration， monitor process statistics for SPC and increase First Pass Yield.

Likewise， the requirement on technical surfaces typically increases with miniaturization as surfaces roughness become more significant and tolerances smaller. True 3D-inspection yields unambiguous quality data and can provide feedback to the manufacturing process.

Miniaturization allows for innovative products with superior performance at reduced costs. Devices such as MEMS and micro-optics make use of production techniques originally developed for integrated circuits. With dimensions down to the micro-meter range， conventional inspection systems are no longer appropriate - especially where three dimensional accuracy needs to be verified.

The M3 helps the developer to quickly gain an in-depth understanding of the true 3D shapes produced by a set of process parameters. The M3 takes 3D profiles of almost any material (reflective and diffusive). For inspection no preparation of the devices is necessary.

The M3 delivers quantitative topological and tomographic data of biological samples in high resolution. Its non-invasive and non-contact measurement principle p-OCT works with non-ionizing visible or near infrared light.

In contrast to scanning electron microscopes， the samples do not need to be coated or evacuated. Thus， the M3 allows for rapid characterization of biological samples and even delivers quantitative 3D data.

Fnology is used for comparing cartridge cases from crime scenes， demonstrating superior performance over legacy 2D systems. Furthermore， the detailed 3D-metrology is instrumental in detecting counterfeits and forgery.

There are numerous possibilities for innovative security products based on micro 3D-features. The M3 is the perfect tool for creating it.